Abstract
In industrial applications, the term extreme materials carries a divergent meaning compared to its academic counterpart. Rather than referring to theoretical properties, extreme materials in our context are those that enable exceptionally high yield, rapid processing, and robust reliability under demanding conditions.
These materials are not just desirable—they are essential for next-generation product performance. This talk will explore the real-world challenges driving the need for such materials across LG Innotek’s key domains: Camera modules, advanced semiconductor substrates, and more.
Mobile camera miniaturization is achieved through advanced optics and high-density packaged actuators, enabling thinner and smaller components for slimmer devices. High-performance semiconductor packaging demands the reliable integration of over one million sub-micrometer precision through vias, robust metallization, and stress mitigation to support high I/O counts on large-area substrates.
We will present our ongoing R&D efforts aimed at addressing these challenges through a materials science. Unlike academic research, our approach is grounded in industrial constraints and performance metrics, requiring solutions that bridge the gap between scientific innovation and manufacturable reality. This presentation will highlight the demands of industrial R&D and the scientific breakthroughs needed to meet them.
Biography
Dr. S. David Roh is the Chief Technology Officer of LG Innotek. He oversees the research and development and technology strategy for advanced optoelectronic devices, laser modules, 3D sensing, and semiconductor packaging. With expertise in III-V semiconductors and photonics, he has been at the forefront of driving innovation in next-generation optical technologies.
He earned his B.S. and Ph.D. in Electrical and Computer Engineering from the University of Illinois at Urbana-Champaign. After gaining experience in the U.S. semiconductor and photonics industry, working at Agilent Technologies, Photodigm, Coherent, he joined LG Innotek in 2010. Since then, he has advanced through leadership roles, being named LG Innotek Fellow in 2010, promoted to Senior Fellow and Vice President in 2019, and later to Senior Vice President in 2023.
In particular, he led the development and commercialization of the world’s first 3D sensing laser module for mobile devices in 2017, contributing to advancements in smart device sensing technology. He is also an IEEE Senior Member, contributing to the academic and industrial progress of optoelectronics and sensing technologies.