Lionel Kimerling

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MIT researchers report major advances toward greater bandwidth, more energy-efficient communications

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Advances in waveguide to waveguide couplers for 3D integrated photonic packaging

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New MIT Device Could Be Key to Faster, More Energy-Efficient Computing and Communications

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Graded Index Couplers for Next Generation Chip-to-Chip and Fiber-to-Chip Photonic Packaging

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Workshop explores new advanced materials for a growing world

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Roadmap to drive integrated photonics industry forward unveiled

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Teaching students about photonics to build up the US workforce

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Sustainable microchip manufacturing is focus of MIT NSF grant