09-14-2026
Abstract - The Center for Heterogeneous Integration for Micro Electronic Systems (CHIMES), one of seven centers under the Joint University Microelectronics Program (JUMP 2.0) supported by the Semiconductor Research Corporation (SRC) and DARPA seeks to develop transformative technological solutions to enable electronic system performance and energy scaling through 3D heterogeneous integration, advanced materials, photonic connectivity, advanced power delivery , cooling, and chip-package-system codesign.
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Carl V. Thompson
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